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Precision CNC Cutting And Dicing Saw
SYJ-400 CNC dicing saw is mainly suitable for dicing, grooving and cutting of various materials such as crystals, ceramics, glass, ore, metal, etc. It adopts a stepper motor, and can be computerized with a position accuracy of 0.01 mm. The sample cutting workbench can be rotated at 360°, and is equipped with a cross mount vise (with 90° positioning die to ensure the accuracy of cutting) and a vacuum chuck(Optional).
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Precision CNC Dicing Saw
SYJ-800 CNC Dicing Saw is a continuous cutting equipment and can be programmable by computer. It is mainly suitable for dicing, grooving and cutting of crystals, ceramics, glass and various slice materials as well as ore and metal, etc. It can dice and cut materials up to 200mm in diameter, 10mm in depth. SYJ-800 CNC dicing saw adopts stepper motor for drive with a cutting accuracy of up to 0.02mm.
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Precision Manual Diamond Wafer Scriber
SYJ-DS100 Precision Manual Wafer Scriber is suitable for cutting thin single crystal substrates, such as silicon, sapphire, Ge, LiNbO3 and LiTaO3 wafers, and the cutting pressure can be adjusted by a spring with the cutting distance of 100mm.
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