• Plasma Cleaner With Vacuum Pump

    Plasma Cleaner With Vacuum Pump

    The plasma chamber of PCE-6 small plasma cleaner is a quartz chamber of Ø160mm×190mm. The RF power used is 3.0MHz (1%), and the output power is adjustable in three levels: 7.2W, 10.2W, and 29.6W. This machine mainly removes the oxide layer and contaminants on the substrates through plasma of air, oxygen or argon and other gases, and can also change the properties of the surface of objects (such as hydrophilicity and hydrophobicity, etc.).

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  • Plasma Cleaner With High RF Power Supply

    Plasma Cleaner With High RF Power Supply

    PCE-6V Small Plasma Cleaner integrates RF plasma generation technology, computer control technology and software programming technology, and uses gas as cleaning medium, which effectively avoids secondary contamination caused by liquid cleaning medium. The sample stage of PCE-6V small plasma cleaner can be equipped with a heating function, and a negative bias voltage can be applied for plasma etching of the sample. In addition, it can change the properties of certain material surfaces as needed under specific conditions.

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  • Atmospheric Plasma Jet-Flow System (Plasma Pen)

    Atmospheric Plasma Jet-Flow System (Plasma Pen)

    GSL-1100X-PJF-(A) Plasma Surface Treatment Instrument is a compact atmospheric plasma jet-flow system for surface treatment, it is mainly composed of a radio frequency generator and an plasma beam head. The jet-flow plasma beam can activate and clean the surface of materials (such as single wafers, optical components, plastics, etc.) under lower temperature and non-vacuum conditions.

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  • Atmospheric Plasma Beam With Automatic Scanning System

    Atmospheric Plasma Beam With Automatic Scanning System

    GSL-1100X-PJF-A Plasma Surface Treatment Instrument is a compact atmospheric plasma jet-flow system for surface treatment, it is mainly composed of a radio frequency generator and an plasma beam head. The jet-flow plasma beam can activate and clean the surface of materials (such as single wafers, optical components, plastics, etc.) under lower temperature and non-vacuum conditions, and the cleaning speed is fast.

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