Plasma Sputtering Coater With 3 Sputtering Sources
VTC-600-3HD Threel-Head Magnetron Sputtering Coater is a coating equipment newly developed by our company, and is used to prepare single-layer or multi-layer ferroelectric film, conductive film, alloy film, semiconductor film, ceramic films, dielectric film, optical film, oxide film, hard film, PTFE film, etc. VTC-600-3HD three-head magnetron sputtering coater is equipped with three target guns, one RF power supply for sputter coating of non-conductive materials, and two DC power supplies for sputter coating of conductive materials.
- Shenyang Kejing
- Shenyang, China
- 22 working days
- 50 sets
- Information
Product Introduction
The VTC-600-3HD is a high-vacuum thin film deposition system independently developed by our company. It is designed for the preparation of various functional thin films and enables high-quality deposition of both single-layer and multilayer structures. This system is widely used for the fabrication of ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical coatings, oxide films, hard coatings, and PTFE films.
The VTC-600-3HD is equipped with three sputtering target assemblies. One target is paired with an RF power supply, suitable for non-conductive materials such as oxides and ceramics, while the other two targets are driven by DC power supplies for sputtering conductive materials such as metals. This configuration offers a wide range of material compatibility.
Compared with similar systems, this model features a compact design, rational structure, and user-friendly operation, while offering excellent multifunctional integration. It is particularly suitable for research laboratories engaged in the development and process study of new material systems, such as solid-state electrolytes and OLED devices. The VTC-600-3HD serves as an ideal laboratory-scale magnetron sputtering system for advanced thin film research.
Main Features
1. It is equipped with three target guns, one RF power supply is used for sputter coating of non-conductive materials, and two DC power supply is used for sputter coating of conductive materials (The target gun can be exchanged according to customer needs).
2. A variety of thin films can be prepared with a wide range of applications.
3. Small size and easy to operate
4. Modular design of the whole machine; separate/split-type design of vacuum chamber, vacuum pump group and control power supply, which can be adjusted according to the actual needs of users.
5. The power supply can be selected according to the actual needs of the user. One power supply can control multiple target guns, or multiple power sources can control one single target gun.
Technical Parameters
Product Name | VTC-600-3HD Threel-Head Magnetron Sputtering Coater | ||
Product Model | VTC-600-3HD | ||
| Installation Conditions | 1.Environment：Ambient temperature: 25℃ ±15℃; Humidity: ≤55%RH ±10%RH. The environment should be dry, dust-free, and free of flammable or explosive gases. 2.Water Supply：Equipped with a KJ-5000 self-circulating chiller, using purified or deionized water. 3. Power Supply：Single-phase AC220V 50Hz, 10A , with a 16A circuit breaker installed at the front end. 4. Gas Requirement：Argon gas (purity ≥99.99%) is required. User should prepare an argon cylinder with Ø6 mm double ferrule fitting and pressure regulator. 5. Workbench Requirement：A stable workbench with dimensions L1300 mm×W750 mm×H700 mm and load capacity of ≥200 kg is recommended. 6. Ventilation：Proper ventilation is required at the installation site; additional air exchange or exhaust system may be installed if necessary. | ||
Major Parameters (Specification) | Category | Specification | Remarks |
Vacuum System | Vacuum Chamber Size：φ295× H265mm | Stainless steel chamber with excellent corrosion resistancy | |
Vacuum Pump Set： · Molecular pump：Hipace80 Turbomolecular pump · Backing Pump：MVP015-2DC Diaphragm Pump | Original Pfeiffer system with high pumping efficiency | ||
Base Vacuum：5.0E-3Pa(5.0E-5hPa) | Base vacuum before deposition | ||
Ultimate Vacuum：5.0E-4Pa(5.0E-6hPa) | Affected by environment and sealing quality | ||
| Working Pressure：0.1~5Pa(0.001~0.05hPa) | Mainly argon, reactive gases optiona | ||
Pumping Speed： · Backing Pump：1 m³/h · Molecular pump：67 L/s | Determines vacuuming time efficiency | ||
| Power Supply Configuration | Power Type & Quantity： · DC (Direct Current): 2 units | DC is used for metallic targets, and RF is used for insulating targets. | |
Output Power Range： · DC：0~500W · RF：0~300W | Adjustable output for various materials | ||
| Matching Impedance：50 Ω | Ensures stable and efficient power transmission | ||
Gas Control | Working Gas：Standard configuration — Argon (Ar) | Recommended to use Argon with a purity of ≥99.999 | |
| Gas Flow (2 Channels)： · Channel 1: 1–100 sccm | Dual independent mass flow channels, customizable for other gases | ||
Flow Meter Accuracy：±1% F.S. | High-precision MFC system | ||
Rotating Sample Stage | Stage Size：Ø132 mm (≈5.2 inch) | Compatible with multiple substrate sizes | |
Rotation Speed：1–20 rpm | Improves film uniformity | ||
| Heating Temperature：RT–500°C | Substrate surface heating with constant temperature control | ||
Temperature Accuracy：±1°C | PID temperature control system | ||
| Magnetron Targets | Target Quantity：3 pcs | Operable individually or simultaneously | |
· Target Size：Ø2 inch · Thickness：0.1–5 mm | Thickness varies by material | ||
| Target–Substrate Distance：85–115 mm Adjustable | Larger distance improves uniformity, slightly reduces rate | ||
| Cooling Method：Water Cooling | Circulating cooling system protects target temperature | ||
Deposition Performance & Others | Film Uniformity：±5%（Ø100 mm Substrate) | Mainly determined by target–substrate distance and rotation spee | |
Film Thickness Range：10 nm–10 μm | Excessive thickness may cause stress cracks | ||
Max. Power Input： · main unit：500 W； · RF power supply：1100 W； · DC power supply：750 W | Independent power systems for main unit, RF, DC, and thickness monitor. | ||
| Input Power： · Single-phase：AC220V 50/60Hz | Proper grounding require | ||
| Main Unit Dimensions： · 600mm×750mm×900mm | Height with lid open: 1050 mm | ||
Overall Dimensions： · 1300m×750mm×900mm | Includes control and pump space | ||
| Total Weight：160kg | Excluding chiller system | ||
Standard Accessories
No. | Name | Quantity | Image |
| 1 | DC Power Supply Control System | 2 sets | - |
| 2 | RF Power Supply Control System | 1 set | - |
| 3 | Film Thickness Monitoring System | 1 set | - |
| 4 | Molecular Pump (German import or domestic with higher pumping speed) | 1 unit | - |
| 5 | Chiller | 1 unit | - |
| 6 | Polyester PU Tube (Ø6mm) | 4m | - |
Optional Accessories
| No. | Name | Function Category | Image |
| 1 | Various Targets (Gold, Indium, Silver, Platinum, etc.) | Optional | - |
| 2 | Strong Magnetic Target (for ferromagnetic material sputtering) | Optional | - |
| 3 | Mask | Optional | - |
| 4 | Vibrating Sample Stage | Optional | - |
| 5 | Dual-Layer Rotating Coating Fixture | Optional |  |
Warranty
One year limited with lifetime support (not including rusted parts due to inadequate storage conditions)
Logistics
