3-target Plasma Sputtering Machine

1. Input Power of 3 Rotary Target Plasma Sputtering Coater: AC 220V 50/60Hz

2. Sputtering Current of 3 Rotary Target Plasma Sputtering Coater: 0-40mA, Adjustable

3. Power: <1kW

4. Output Voltage: Maximum 1680V DC

1. Material: Quartz chamber

2. Dimensions: OD 166mm × ID 150mm × 150mm

3. Sealing: O-ring seal

4. A manually operable baffle is installed on the flange cover for pre-sputtering the target. A φ 6.35 mm compression fitting serves as the air inlet port for connecting to the inlet pipe. A manual air bleed valve is used to inject air into the quartz chamber.

5. A stainless steel mesh cover covers the entire quartz chamber to shield the plasma.

6. The flow rate of the working gas entering the quartz chamber is controlled by adjusting the micro-precision control valve on the right side of the housing, thereby adjusting the vacuum level within the chamber.

7. The sputtering current is controlled by adjusting the potentiometer on the right side of the housing.

1. Three copper targets are standard.

2. Target dimensions: φ47 x (0.1-3) mm thick.

3. Other metal targets are available for purchase from our company; please contact our sales department for details.

4. A manually operated baffle is installed for pre-sputtering the target.

1. A 50mm rotatable sample stage with screws on the sample stage support column to adjust the sample stage height.

2. Sample stage rotation angle: 0/120/240 degrees.

3. The distance between the target and the sample stage is adjustable from 20 to 70mm.

4. The sample stage can be optionally heated, with a maximum temperature of 500°C.

A 1.4" PLC integrated touchscreen control panel controls vacuum, current, and sample sputtering time.

2. A data logging function records process parameters such as vacuum, current, and sputtering time for each sputtering run, making it easy for customers to access the data.

1. Model: VRD-8

2. Pumping rate: 2.2 L/s

3. Motor power: 370 W

4. Ultimate pressure: 5 × 10-1 Pa (unloaded).

5. Actual pressure: ≤ 5 Pa (20 minutes of mechanical pumping under cold conditions).

6. If you want to get a higher vacuum degree (10-5 toor or better), you can choose to purchase domestic or imported high vacuum units.

Dimensions: 460mm × 400mm × 500mm (L × W × H)

Weight: Approximately 20kg

1. Multiple sputtering cycles are required to achieve the desired film thickness.

2. Before sputtering, ensure the sputtering head, target, sample, and sample stage are clean.

3. To ensure a good bond between the film and the substrate, clean the substrate surface before sputtering. Our cleaning equipment can be used for this purpose.

4. This equipment can be used for sputtering in a glove box (Ar or N2 atmosphere).

1. The chamber pressure must not exceed 0.02MPa (relative pressure).

2. Due to the high pressure inside the gas cylinder, a pressure reducing valve must be installed when introducing gas into the quartz tube. To ensure safety, we recommend operating at a pressure below 0.02MPa. We recommend purchasing a pressure reducing valve from our company, which has a range of 0.01MPa-0.1MPa, for greater accuracy and safety.

3. We do not recommend the use of flammable, explosive, or toxic gases. If your process requires the use of flammable, explosive, or toxic gases, please implement appropriate protective and explosion-proof measures. Our company assumes no responsibility for any problems arising from the use of flammable, explosive, or toxic gases.