Small DC Magnetron Plasma Sputtering Machine

1. Input Power of Small magnetron plasma sputtering instrument: 220V AC 50/60Hz

2. Power of Lab DC Magnetron Sputtering Coater Machine: <1000W

3. Output Voltage of Lab DC Magnetron Sputtering Coater Machine: DC 500V

4. Sputtering Current: 0-80mA, adjustable

5. Sputtering Time: 0-120s, adjustable

1. Quartz Chamber Dimensions: OD 166mm x ID 150mm x Height 150mm

2. Seal: Fluorine rubber O-ring

3. A manually operable shutter is installed on the flange cover for pre-sputtering the target. A 6.35mm Ø compression fitting serves as the air inlet port for connecting the air inlet pipe. A manual air bleed valve is used to fill the quartz chamber with air.

4. A stainless steel mesh covers the entire quartz chamber to shield the plasma.

5. The flow of working gas into the chamber is controlled by adjusting the micro-precision control valve on the right side of the housing, thereby adjusting the vacuum level within the chamber.

6. The sputtering current is controlled by adjusting the potentiometer on the right side of the housing.

1. A 2-inch magnetron sputtering target head without water cooling. The maximum operating temperature of the magnetron sputtering target head is 80 degrees Celsius. Above 80 degrees Celsius, the magnetron sputtering target head will lose its magnetism and become inoperable.

2. Sputtering time: Adjustable from 1 to 120 seconds

3. Standard copper target included

4. Target size requirement: φ2" x (0.5-5) mm thickness

5. Suitable for sputtering Au, Ag, Cu, and other metals (available for purchase at our company).

1. A sample stage with adjustable height, with an adjustable distance between the sample stage and the target of 25-70 mm.

2. Sample stage size: φ2"

3. Optional sample stage heating, with a maximum heating temperature of 500°C.

1. Measuring range: 1 × 10-4 mbar to 1000 mbar (1 × 10-4 to 750 torr)

2. Accuracy: 1000 mbar to 20 mbar (30% of reading)

20 to 0.002 mbar (2% of reading)

3. Repeatability: 20 to 0.002 mbar (0.000 to 0.002 mbar) 2%)

4. Operating humidity: ≤80% at 30°C, ≤50% at 40°C, no condensation;

5. Operating temperature: 5°C-60°C

1. A precision quartz vibrating film thickness gauge is installed on the instrument, enabling real-time monitoring of film thickness with a resolution of 0.10 Å.

2. The LED display provides both display and input of film thickness data.

1. Model: VRD-8

2. Pumping rate: 2.2 L/s

3. Motor power: 370 W

4. Ultimate pressure: 5 × 10-1 Pa (unloaded)

5. Actual pressure: ≤ 5 Pa (mechanical pumping for 20 minutes under cold conditions)

6. For higher vacuum levels (10-5 tons or better), domestic or imported high vacuum units are available.

Dimensions: 500mm × 350mm × 550mm (L × W × H)

Weight: Approximately 20kg (excluding vacuum pump and water cooling equipment)

1. Multiple sputtering cycles are required to achieve the desired film thickness.

2. Before sputtering, ensure the sputtering head, target, substrate, and sample stage are clean.

3. To ensure good adhesion between the film and the substrate, clean the substrate surface before sputtering.

One-year warranty and lifetime technical support.

Special Notes:

1. Consumables such as heating elements, quartz tubes, and sample crucibles are not covered by the warranty.

2. Damage caused by the use of corrosive and acidic gases is not covered by the warranty.

· The pressure inside the chamber must not exceed 0.02 MPa (relative pressure).

· Because the internal pressure of the gas cylinder is relatively high, a pressure reducing valve must be installed on the cylinder when introducing gas into the quartz tube. To ensure safety, we recommend operating the pressure below 0.02 MPa. We recommend purchasing a pressure reducing valve from our company, which has a range of 0.01 MPa-0.1 MPa, for greater accuracy and safety.

· We do not recommend the use of flammable, explosive, or toxic gases. If your process requires the use of flammable, explosive, or toxic gases, please implement appropriate protective and explosion-proof measures. Our company is not responsible for any problems caused by the use of flammable, explosive, or toxic gases.