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Diamond Lapping Film
1. Uniformly distributed micron/nano-sized diamonds ensure stable grinding and high surface precision.
2. Suitable for grinding and polishing fiber optic connectors, optical glass, crystals, LEDs, LCDs, and semiconductor materials.
3. PSA adhesive backing allows for quick attachment to the polishing pad, making it compatible with UNIPOL series grinding and polishing equipment.
- Shenyang Kejing
- Shenyang, China
- 10 working days
- 1000pcs
- Information
Product Introduction
Diamond polishing film utilizes internationally advanced ultra-precision coating technology to uniformly disperse micron or nano-sized grinding powder (diamond) with novel polymer materials, coat it onto a high-strength film surface, and then process it using a high-precision cutting process.
Fiber optic polishing film is mainly used for grinding various inorganic non-metallic materials requiring high surface flatness, such as grinding fiber optic connectors (coarse, medium, and fine grinding); polishing hard disk heads and disk surfaces; grinding and polishing optical glass, optical crystals, LEDs, and LCDs; and grinding and polishing semiconductor materials (gallium arsenide, indium phosphide, etc.).
PSA diamond polishing sheet is mainly suitable for our company's UNIPOL series grinding and polishing machines. The back of the polishing paper has adhesive, allowing it to be directly attached to the polishing film, then adsorbed onto the surface of the polishing disc, and then used for grinding and polishing samples.
Key Features:
Diamond Polishing Film has good strength and flexibility, improving grinding quality.
Fiber Optic Polishing Film has good durability and high grinding efficiency.
Samples polished with PSA Diamond Polishing Sheet exhibit high flatness.
Technical Parameters:
| Product Name | Diamond Polishing Film |
| Main Parameters | 1. Grit Size: 0.5µm, 1µm, 3µm, 6µm, 9µm, 15µm, 16µm, 30µm 2. Diameter: Ø203mm, Ø300mm, Ø381mm |
Company Strength:
Founded in May 2000, Shenyang Kejing Automation Instrument Co., Ltd. has been committed to the research, development, and manufacturing of materials preparation and analysis equipment. Since the launch of the first SYJ-150 low-speed diamond saw, the company has continuously expanded its product portfolio and technological capabilities.
Comprehensive Product Portfolio:
Kejing provides hundreds of equipment models and related consumables, covering key processes in materials research and sample preparation, including:
Material cutting.
Grinding and polishing.
Coating and film deposition.
Mixing and rolling.
Sintering and heat treatment.
Material analysis.
Logistics and Delivery Guarantee:
Shenyang Kejing supports orders starting from 1 unit/set (excluding consumables), flexibly meeting diverse procurement needs from basic research to small-scale pilot production. The delivery cycle for regular products is typically 10 working days. The company supports various logistics methods, including express delivery, air freight, and sea freight. All equipment is strictly packaged in export-grade wooden crates that meet international standards, with professional shockproof, reinforced, and moisture-proof treatment, committed to providing global customers with a safe and timely delivery experience.
Partners:
Domestic: Tsinghua University, Peking University, Chinese Academy of Sciences (CAS), Shandong University, University of Electronic Science and Technology of China, and other universities and research institutions.
International: Serving numerous research institutions and enterprises worldwide (having hosted over 100 groups of foreign clients for on-site visits).
Service Guarantee:
Warranty: 1-year warranty on the entire machine (excluding consumables such as heating elements and seals).
After-sales: 24/7 customer service, providing professional operation guidance.
