• Diamond Band Saw For Cutting Max.30mm T

    Diamond Band Saw For Cutting Max.30mm T

    SYJ-D2000 Diamond Band Saw uses circular electroplated diamond cutting band when cutting samples. On its surface, there are dense diamond particles and sharp cutting edges. The equipment is especially suitable for cutting fragile materials such as glass, ceramics, jade, marble, concrete, etc. It can also be used for cutting and sampling biomedical materials, such as joint slices or plasticized thin slices of soft and hard tissues of bones, teeth, body and organs.

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  • Manual Diamond Blade Saw

    Manual Diamond Blade Saw

    SYJ-200H Manual High Speed Cut-Off Saw is suitable for rough machining of various crystals, ceramics, glass, rocks, printed circuit boards (PCB), composite materials, high polymer materials, metal materials, and others. It can use sintered diamond blades, electroplated diamond blades and resin blades.

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  • Single-Crystal Orientation Machine

    Single-Crystal Orientation Machine

    DX-100 X-ray single-crystal orientation machine is a high-tech precision instrument of optical, mechanical and electrical integration, which can quickly determine the crystal plane of natural and artificial crystals. It can be used with various cutting, grinding and other processing equipment, and is an indispensable instrument for precision processing and manufacturing crystal components. X-ray single crystal orientation machine uses the principle of X-ray diffraction for orientation of crystal, silicon, germanium single crystal, lithium niobate, lithium tantalate, yttrium vanadate, laser crystal, optical fiber communication crystal, and other single crystal material. The machine is simple to operate, and is an ideal equipment for a variety of single crystal materials at scientific research institutions and factories. DX-100 X-ray sing-crystal orientation machine is equipped with a single workbench with a large pallet to meet the orientation of ingots, rods, and wafer endfaces. It is divided into upper and lower parts. It is small in size, and easy for desktop measurement, which can meet the orientation measurement of single-crystal crystals and make corresponding judgment on the quality of the crystals.

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  • Diamond Wire Saw For Cutting Max. 1m

    Diamond Wire Saw For Cutting Max. 1m

    STX-4001 Diamond Wire Saw is designed for cutting samples of different rigidity such as ceramics, crystals, glass, metals, rocks, thermoelectric materials, infrared optical materials, composite materials, and biomedical materials, etc. It is mainly used to machine larger size materials and the cutting size is up to 1m. STX-4001 diamond wire saw is especially suitable for cutting samples over 24''. It can also be used to cut artificial seed crystals of as silicon, sapphire, and sapphire. When used in the slicing precious gemstones, meteorites and biological plasticized specimens.

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  • Precision CNC Cutting And Dicing Saw

    Precision CNC Cutting And Dicing Saw

    SYJ-400 CNC dicing saw is mainly suitable for dicing, grooving and cutting of various materials such as crystals, ceramics, glass, ore, metal, etc. It adopts a stepper motor, and can be computerized with a position accuracy of 0.01 mm. The sample cutting workbench can be rotated at 360°, and is equipped with a cross mount vise (with 90° positioning die to ensure the accuracy of cutting) and a vacuum chuck(Optional).

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  • Diamond Wire Saw For Cutting Various Shapes Max. 50mm T

    Diamond Wire Saw For Cutting Various Shapes Max. 50mm T

    STX-50QX Diamond Curve Cutting Machine is the first equipment in our company that uses diamond wire to cut non-metallic materials of irregular shapes. The equipment can set the cutting shape through computer drawing, and then the diamond wire travels according to the path set by the drawing, thereby cutting out various shapes. The equipment effectively solves the problem of special-shaped cutting of some difficult-to-process materials, such as ceramics, crystals, glass, metals, composite materials, rocks, thermoelectric materials, infrared optical materials, composite materials and biomedical materials.

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  • Diamond Band Saw For Cutting Max.100mm T

    Diamond Band Saw For Cutting Max.100mm T

    SYJ-D4000 Diamond Band Saw is a small diamond cutting machine, it is easy operation with manual cutting and automatic cutting methods. The equipment is especially suitable for cutting non-metal materials such as glass, ceramics, jade, marble, concrete. It can also be used for cutting and sampling biomedical materials, such as joint slices or plasticized thin slices of soft and hard tissues of bones, teeth, body and organs. It can cut in straight lines, and samples of irregular and other geometric shapes.

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  • Wafer Puncher for Metals

    Wafer Puncher for Metals

    PM200 metal wafer puncher can be used together with a distortion-free transmission electron microscope (TEM) when preparing samples. The product punches the metal disc to obtain the required sample, which reduces the difficulty of manual manufacturing as well as the preparation time. The product is used to prepare wafers of 3mm diameter, and is mainly used for metal materials with extensibility and good toughness. Compared with similar products on the market, PM200 metal wafer puncher has better repeatability and higher dimensional accuracy when preparing wafer samples of the same size, and the service life is several times that of similar products. PM200 metal wafer puncher is made of light aluminum alloy as the base, and the surface is treated with special sandblasting oxidation, which makes it very smooth when touched. The punch head is made of die steel and its surface hardness and wear resistance are improved after heat treatment, therefore the service life is greatly increased. The product uses a lever structure to reduce the force of the operator and is ergonomic friendly. If wafers of special sizes are required, the puncher can be customized individually.

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  • Precision CNC Round Cylinder Sample Puncher

    Precision CNC Round Cylinder Sample Puncher

    SYJ-30QY Round Cylinder Sample Puncher for sampling is specially used for drilling cylindrical or annular samples of solid materials. SYJ-30QY round cylinder sample for sampling can be used for a wide range of samples, such as crystal, ceramic, metal, glass, rock, rock core, plastic, PCB board, refractory material, composite material, etc. It can be used for samples from Ø3mm-Ø30mm with no requirement for the shape and surface state of the sample. For brittle materials, the minimum sampling size is Ø3mm, suitable for sampling electron microscope samples.

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