STX-1220 Lab Precision Integrated Crystal Orientation Cutter
1. Our Precision Cutting and Crystal Orientation Equipment integrates X-ray orientation and diamond wire cutting technologies, ensuring cutting that is both highly precise and efficient.
2. The Precision Cutting and Crystal Orientation Equipment requires no secondary clamping during operation, thereby eliminating potential positioning errors.
3. This equipment is specifically designed for the precise analysis and sample preparation of brittle crystals and hard-brittle materials. Its applications span various sectors, including semiconductors, electronic materials, advanced materials, and geology/mineral analysis.
- Shenyang Kejing
- Shenyang, China
- 10 working days
- 50 sets
- Information
Introduction of the Precision integrated crystal orientation cutter:
The STX-1220 Precision integrated crystal orientation cutter is primarily utilized for the precision cutting and crystal orientation processing of samples intended for materials analysis. The system consists of an integrated assembly comprising a diamond wire cutter and an X-ray orienter. Through programmable control of the cutter's Y-axis, the system achieves precise alignment with the orienter, thereby satisfying the specific positional and angular requirements for the crystal during the orientation process.
Once the crystal orientation is complete, the sample can be returned directly to the cutting zone via the same Y-axis for processing. This eliminates the need for secondary clamping, effectively minimizing angular deviations that typically arise from repetitive repositioning. This Precision integrated crystal orientation cutter achieves a unified workflow for crystal orientation and cutting, significantly enhancing processing efficiency and positioning accuracy. It is ideally suited for the preparation of crystal materials and samples for materials analysis.
Technical Specifications of the Precision Integrated Crystal Orientation Cutter:
| Product Name | STX-1220 Precision integrated crystal orientation cutter |
| Product Model | STX-1220 |
| Installation Requirements of crystal orientation and cutting machine | 1. Temperature and Humidity: 10-85%RH (at 25℃, non-condensing) Temperature: 0-45℃ 2. No strong vibration sources or corrosive gases around the equipment. 3. Air Source (Compressed Air): ≥0.6Mp 4. Coolant: Required (cutting oil recommended) 5. Power Supply: Single phase: AC220V 50Hz national standard three-pole socket 10A, must have good grounding. 6. Worktable: Not required. 7. Ventilation: No special requirements. |
| Main Parameters of crystal orientation and cutting machine | 1. Power Supply Interface: National Standard (GB) 3-pin socket with fuse; AC 220V, 50Hz, 10A 2. Total Power: 550W 3. Main Structure: Aluminum alloy frame 4. Diamond Wire Length: ≤ 150m 5. Diamond Wire Diameter: φ0.25 – 0.45mm 6. Diamond Wire Tensioning Method: Adjustable pneumatic tensioning 7. Tension Pressure Adjustment Range: 0 – 1 MPa 8. Spindle Cutting Rotation Mode: Reciprocating rotation 9. Spindle Drive Motor: AC variable frequency + reducer; AC 220V, 300W 10. Spindle Speed (Linear Velocity): 0 – 8 m/s (Adjustable) 11. Cutting Speed: 0.05 – 40 mm/min 12. Return Speed: 1 – 100 mm/min 13. Z-axis Workbench Effective Travel: 1 – 250 mm (Max. oriented cutting diameter: 8-inch crystal) 14. Y-axis Workbench Effective Travel: 1 – 590 mm 15. Z-axis and Y-axis Feed Accuracy: 0.01 mm 16. Sample Stage: Motorized 3D rotary stage; Horizontal rotation: 0 – 360° 17. Angle Stage Tilt Range: 0.001° – 8°; R-axis rotation: 0.001° – 15° 18. Crystal Goniometry (Angle Measurement): θ: 0 – 40° 19. Y-axis, Z-axis, and R-axis Drive Motors: Precision stepper motors 20. Max. Inner Spacing Between Guide Wheels: ≤ 425 mm 21. Max. Workpiece Dimensions (Diameter x Length): Φ200 mm x 150 mm 22. Workbench Center Load Capacity: ≤ 20 kg 23. Control System: PLC controller + 7-inch touch screen 24. Parameter Display Format: Digital 25. Safety Control Devices: Wire spool over-travel protection; Automatic shut-off upon wire breakage Emergency Stop Switch. 26. Specifications of crystal orientation and cutting machine: · Dimensions: 2500 x 900 x 1930 mm · Weight: Approx. 600 kg
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| Compliance | CE Certified, UL or CSA certification is available at extra cost. |
Key Features of the Crystal Orientation and Cutting Machine:
1. The design of the machine is optimized to enhance the precision of orientation and cutting operations.
2. No secondary clamping is required, thereby reducing angular errors and boosting processing efficiency.
3. The machine is suitable for the precision cutting of brittle crystals and hard-brittle materials.
4. Featuring an aluminum profile structure, the machine is both lightweight and robust.
Applications & Real-World Experience.
The STX-1220 Precision Integrated Crystal Orientation Cutter is a specialized sample preparation system developed based on years of feedback regarding the practical pain points encountered by top-tier materials science laboratories. We understand that when processing expensive and fragile single-crystal materials, even minute angular deviations or stress-induced damage can lead to the complete failure of an entire experiment.
Core Applicable Materials & Fields:
Semiconductor Materials: Precise orientation slicing of crystals such as Silicon Carbide (SiC), Silicon (Si), Gallium Nitride (GaN), etc.
Optical & Laser Crystals: Low-damage cutting of hard and brittle crystals, including Sapphire, Quartz, Lithium Niobate, etc.
Geology & Mineral Analysis: Exposure and preparation of specific crystal planes in complex rock samples.
Why Choose Shenyang Kejing?
As a professional manufacturer of automated equipment and materials sample preparation systems, Shenyang Kejing offers not just equipment, but complete solutions.
· Supported by the Kejing Open Laboratory: We operate a fully equipped "Shenyang Kejing Open Laboratory." Before you commit to a purchase, we offer pre-sales product trials as well as material processing and verification services. You can send us your samples, and we will demonstrate the equipment's capabilities using actual cutting data.
· Professional Process & Experimental Training: Equipment delivery is just the beginning. We provide in-depth training on experimental processes to ensure your research team can quickly master the complex operations involved in crystal orientation and precision cutting.
· Deep Collaboration with Academia & Industry: We are long-term advocates of "Joint Laboratories/Project Partnerships" and "Patent/Research Commercialization." By staying abreast of the evolving needs of cutting-edge materials science, our equipment designs consistently meet the latest research standards.
· Custom Equipment Solutions: In addition to our standard models, we leverage our robust R&D capabilities to offer custom equipment solutions, ensuring we can meet your specific experimental requirements.
