Dual-Plate Pressure Lapping and Polishing Machine
1. Our precision lapping and polishing equipment is equipped with an automated pressure system, thereby reducing manual labor requirements.
2. Our precision lapping and polishing equipment maintains constant pressure, minimizing experimental errors.
3. This precision lapping and polishing equipment allows for the simultaneous lapping and polishing of two samples, reducing processing time and accelerating the overall workflow.
- Shenyang Kejing
- Shenyang, China
- 44 working days
- 50 sets
- Information
Introduction of the auto lapping and polishing machine:
The UNIPOL-1260D Double Disc auto lapping and polishing machine employs a mechanical pressurization mechanism to ensure that samples maintain constant pressure throughout the grinding process. This double disc polisher and grinder features two horizontally movable pressure grinding plates and a mechanical swing-arm workstation; it offers stable, adjustable rotational speeds and a wide pneumatic pressure range. The double disc polisher and grinder is particularly well-suited for the grinding, thinning, and fine polishing of sheet-like ultra-hard materials.
Technical Specifications of the Professional-Grade Pressure Grinding and Polishing Machine:
| Product Name | UNIPOL-1260D Dual-Disc Pressure Grinding and Polishing Machine |
| Product Model | UNIPOL-1260D |
| Main Specifications | 1. Power Supply: 220V, 50Hz 2. Sample Holders: Ø100 mm × 2; Rotation Speed: 10–60 rpm 3. Grinding Disc: Rotation Speed: 20–250 rpm; Dimensions: Ø320 mm 4. Gravity Sample Holder: Ø110 mm 5. Air Source: 0.6–0.8 MPa 6. Pneumatic Pressurization: Range 30–250 N 7. Overall Dimensions: 500 mm × 1500 mm × 1400 mm 8. Weight: 300 kg |
| Compliance | CE Certified, UL or CSA certification is available at extra cost. |
Advantages of the Professional-Grade Pressure Grinding and Polishing Machine:
1. Constant Pressure System:
This machine employs an advanced mechanical pressurization mechanism to ensure that the sample is subjected to uniform and constant pressure throughout the entire grinding cycle, thereby preventing surface damage or thickness irregularities caused by pressure fluctuations.
2. High-Efficiency Dual-Station Operation:
Equipped with two sets of horizontally movable grinding discs and mechanical swing arms, the machine supports simultaneous multi-station operation, significantly boosting processing efficiency for both laboratory research and small-batch production environments.
3. Precise Speed Control:
The sample carrier (10–60 rpm) and the grinding disc (20–250 rpm) feature independent speed control, accommodating a wide spectrum of processing requirements—ranging from coarse grinding to mirror-finish polishing.
4. Broad Application Compatibility:
This machine is particularly well-suited for processing thin, high-hardness sheet materials (such as silicon carbide, gallium nitride, ruby, etc.).
Applications of auto lapping and polishing machine:
1. Semiconductor Processing:
Precision planarization (CMP) of silicon wafers and compound semiconductor substrates.
2. Optical Engineering:
Precision grinding of high-precision lenses, optical filters, and sapphire windows.
3. Materials Research:
Sample preparation for microstructure observation of metal specimens, advanced ceramics, and composite materials.
FAQ of auto lapping and polishing machine:
Q: What sample sizes is the UNIPOL-1260D double disc polisher and grinder suitable for processing?
A: Equipped with Ø320mm grinding discs and compatible with Ø100mm or Ø110mm sample carriers, this double disc polisher and grinder is ideally suited for processing 4-inch wafers (or smaller) or for the batch processing of multiple small samples.
Q: What is the difference between mechanical pressure and pneumatic pressure?
A: The UNIPOL-1260D combines the advantages of both: its mechanical structure ensures stability, while the pneumatic system provides flexible pressure adjustment ranging from 30 to 250 N—making it suitable for processing precision materials that are sensitive to pressure.
