SiC Lapping Film

Introduction of SiC Lapping Film (PSA):

SiC lapping film (PSA) is manufactured using internationally advanced ultra-precision coating technology.  Micron or nano-sized abrasive powders (silicon carbide) are uniformly dispersed in a novel polymer material and coated onto the surface of a high-strength film.  This is then processed using high-precision cutting technology. SiC lapping film (PSA) is primarily used for grinding various inorganic non-metallic materials requiring high surface flatness, such as rough grinding and deburring of ceramic ferrules; grinding and polishing of plastic ferrules; and precision grinding and polishing of magnetic heads. SiC lapping film (PSA) is mainly suitable for use with the UNIPOL series grinding and polishing machines manufactured by our company. The grinding film has an adhesive backing, allowing it to be directly attached to the polishing base plate and then adhered to the grinding disc surface for sample grinding and polishing.

Main features of silicon carbide lapping film:

1. Silicon carbide lapping film possesses good strength and flexibility, improving grinding quality.

2. It has good durability and high grinding efficiency.

3. The ground samples exhibit high surface flatness.

Technical Parameters:

About us：

1. We have accumulated and applied for dozens of invention patents and utility model patents, filling several gaps in domestic diamond wire cutting and ultra-high-pressure precision sample preparation technologies.

2. We actively participate in international academic conferences such as ICPNS (Russia) and PRICM (Pacific Rim International Conference on Advanced Materials), with our services reaching multiple countries and regions worldwide.

3. Relying on our experienced sample preparation technology team, we not only provide equipment but also mature sample preparation process technologies.