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SiC Lapping Film
1. Utilizing internationally leading ultra-precision coating technology, micro- and nano-sized silicon carbide (SiC) abrasive particles are uniformly dispersed on the surface of a high-strength thin film.
2. It possesses excellent mechanical strength and flexibility, offering high durability and outstanding grinding efficiency.
3. It comes with high-quality pressure-sensitive adhesive (PSA) and is accompanied by mature sample preparation process guidelines.
- Shenyang Kejing
- Shenyang, Liaoning
- 10 working days
- 1000pcs
- Information
Introduction of SiC Lapping Film (PSA):
SiC lapping film (PSA) is manufactured using internationally advanced ultra-precision coating technology. Micron or nano-sized abrasive powders (silicon carbide) are uniformly dispersed in a novel polymer material and coated onto the surface of a high-strength film. This is then processed using high-precision cutting technology. SiC lapping film (PSA) is primarily used for grinding various inorganic non-metallic materials requiring high surface flatness, such as rough grinding and deburring of ceramic ferrules; grinding and polishing of plastic ferrules; and precision grinding and polishing of magnetic heads. SiC lapping film (PSA) is mainly suitable for use with the UNIPOL series grinding and polishing machines manufactured by our company. The grinding film has an adhesive backing, allowing it to be directly attached to the polishing base plate and then adhered to the grinding disc surface for sample grinding and polishing.
Main features of silicon carbide lapping film:
1. Silicon carbide lapping film possesses good strength and flexibility, improving grinding quality.
2. It has good durability and high grinding efficiency.
3. The ground samples exhibit high surface flatness.
Technical Parameters:
| Product Name | Silicon Carbide Abrasive Paper |
| Main parameters | 1. Particle size: 1µm, 3µm, 5µm, 9µm, 15µm, 30µm 2. Diameter: Ø203mm, Ø300mm, Ø381mm |
About us：
1. We have accumulated and applied for dozens of invention patents and utility model patents, filling several gaps in domestic diamond wire cutting and ultra-high-pressure precision sample preparation technologies.
2. We actively participate in international academic conferences such as ICPNS (Russia) and PRICM (Pacific Rim International Conference on Advanced Materials), with our services reaching multiple countries and regions worldwide.
3. Relying on our experienced sample preparation technology team, we not only provide equipment but also mature sample preparation process technologies.
Laboratory:
We have accumulated years of experience in the field of laboratory equipment research and development. We not only have a deep understanding of various experimental needs, but also continue to promote technological innovation. Different materials, different samples, and different targets have all been specially developed and designed. Our R&D team works closely and efficiently with multiple scientific research institutions to ensure the high technical level and use effect of the equipment by understanding the needs in real projects.
At the same time, our product line covers multiple fields of laboratory equipment, Cutting and Dicing Saw, Grinding and Polishing Machine, Melting System, Lab Oven, etc. For your different research directions, we have corresponding equipment to assist your project and improve the actual performance and accuracy of the project.
