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Shenyang Kejing Unveils Four Major New Laboratory Products: Setting New Standards in Materials Preparation and Analysis

2026-03-16 22:09

In the rapidly evolving field of materials science, high-precision sample preparation and analysis equipment serves as the cornerstone for achieving groundbreaking scientific research results. As a leading domestic manufacturer of laboratory equipment, Shenyang Kejing remains steadfast in its commitment to technological innovation. Recently, Shenyang Kejing held a grand product launch event to officially introduce four newly upgraded, flagship devices.


The four new products unveiled at this event cover the entire materials preparation workflow—ranging from crystal cutting and surface grinding to thin-film deposition and metallographic analysis. They are designed to provide universities, research institutes, and corporate R&D centers with more precise, efficient, and intelligent solutions.


1. Integrated Crystal Orientation and Cutting System: Eliminating Errors from Secondary Clamping.

When processing brittle crystalline materials, ensuring perfect alignment between the cut surface and the crystal's specific crystallographic orientation has long been a technical challenge. Shenyang Kejing’s newly introduced Integrated Crystal Orientation and Cutting System offers a breakthrough solution by seamlessly combining an "X-ray Crystal Orientator" with a "Diamond Wire Saw."

Integrated Crystal Orientation and Cutting System

Core Advantages and Operating Principles:

- Seamless Integration, Enhanced Efficiency:

Once the crystal has undergone X-ray orientation on the device's sample stage, the stage—guided by precise built-in program controls—moves parallel along the Y-axis to directly enter the cutting station for processing. This integration of the two processes significantly reduces the time required for manual handling and material transfer. 

- Elimination of Secondary Clamping Errors:

In traditional workflows, orientation and cutting are performed separately; the process of unmounting and remounting the sample between stages frequently introduces angular deviations. This integrated system eliminates the need for "re-clamping after orientation," thereby fundamentally guaranteeing a high degree of consistency between the final cut surface and the target crystallographic orientation. - A Boon for Brittle Materials: Leveraging the flexible processing characteristics and precise directional control of diamond wire cutting, this equipment is particularly well-suited for processing high-value crystalline materials that are prone to cleavage and brittleness (such as silicon carbide, sapphire, semiconductor wafers, etc.).


2. Dual-Station Automatic Pressure Grinding and Polishing Machine: The Ideal Choice for Super-Hard Material Thinning.

High-quality surface grinding and polishing constitute an indispensable step prior to material characterization. The newly upgraded Dual-Station Automatic Pressure Grinding and Polishing Machine is positioned as a "high-precision grinding device with stepless pressure adjustment," specifically engineered for high-standard batch production and advanced process optimization.

Integrated Crystal Orientation and Cutting System

Product Highlights:

- Robust Process Adaptability: Whether processing conventional metals or super-hard materials, its high-standard hardware configuration delivers stable and sustained grinding power. 

- Dual Sample Holders with Lateral Reciprocating Motion: This latest upgrade features a dual-sample holder design and supports lateral reciprocating movement of the holders during the grinding process. This innovative design significantly ensures the flatness and uniformity of the ground and polished surfaces. 

- Application Scenarios: Highly suitable for the grinding, thinning, and high-gloss polishing of super-hard materials (such as ceramics, cemented carbides, and various types of wafers).


3. Vacuum Spin Coater: Empowering Cutting-Edge R&D in Thin-Film Materials.

In the fields of new energy, semiconductors, and nanomaterials, thin-film preparation technology is of paramount importance. Shenyang Kejing’s newly launched Vacuum Spin Coater integrates precise process control, reliable quality, and flexible expandability into a single unit.

Integrated Crystal Orientation and Cutting System

Newly Upgraded Configuration:

- Intelligent Touchscreen Control: The upgraded touchscreen interface is more intuitive, supporting multi-stage program control that allows for the one-touch execution of complex coating processes.

- Sample Holder Heating and Vacuum Adsorption: Samples are secured via vacuum adsorption, ensuring a safe and firm hold; additionally, the newly added sample holder heating function offers immense convenience for specialized polymer coating applications or thin-film experiments requiring in-situ baking. 

- Lid-Open Safety Protection: With laboratory safety as a top priority, an automatic safety mechanism has been incorporated to prevent accidents during operation. - Target Users: This device serves as an exceptional tool for laboratories at major universities and research institutes engaged in the R&D of various thin-film materials (such as photoresists, perovskite solar cell coatings, etc.).


4. Electropolisher (EP-1030): Revealing the True Internal Structure of Materials.

During high-magnification microscopic observation (e.g., SEM, EBSD analysis), mechanical polishing often leaves a deformation layer or residual stress on the sample surface, thereby compromising the accuracy of the observation results. The EP-1030 Electropolisher, introduced by Shenyang Kejing, perfectly resolves this critical challenge.

Integrated Crystal Orientation and Cutting System

Technical Highlights:

- Non-destructive Electrochemical Polishing: Utilizing electrochemical principles to induce anodic dissolution, this device enables the preparation of metallographic samples that are completely free of mechanical processing-induced deformation layers.

- True Structure Revelation: By thoroughly eliminating surface stress or microscopic damage potentially caused by mechanical polishing, it provides the most authentic representation of the material's original internal microstructure.

- Modularity and High Scalability: The device features a visually striking exterior design, distinguished by a refreshing blue-and-yellow color scheme. Its modular functional design not only enhances scalability but also facilitates future maintenance and upgrades.

- Application Fields: It is particularly well-suited for scientific research analyses requiring exceptionally high surface quality—such as the preparation of samples involving special alloys or soft metallic materials prone to work hardening.


The four new products unveiled by Shenyang Kejing represent not merely a comprehensive upgrade to existing material preparation processes, but also a precise response to the daily challenges faced by the broader scientific research community. From the precision cutting of crystals to the preparation of nanoscale thin films, and extending to stress-free metallographic sample preparation, Shenyang Kejing—through the exceptional performance of its equipment—empowers materials science research in China and across the globe to reach new heights.


Interested in learning more details or requesting a demo unit? We invite you to visit the official Shenyang Kejing website (https://www.shykejing.com) or contact our technical sales team directly to obtain detailed technical specifications and pricing proposals.


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