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As an innovative tool of modern cutting technology, Diamond Wire Cutting Saw occupies an important position in industry and scientific research with its excellent cutting ability and wide application fields.

In the field of precision machining, it is important to choose a suitable low speed diamond cutting machine. A high-quality cutting machine can not only ensure the processing effect, but also improve production efficiency. The following are some important factors that we have sorted out to consider when choosing a low speed diamond cutting machine, I hope it will be helpful to everyone.

During this Dragon Boat Festival filled with traditional cultural atmosphere, our company held a series of wonderful celebrations, allowing all employees to feel the strong festive atmosphere and the company's care in addition to their busy work.

Endless Diamond Wire Saw is designed for fragile, brittle and small-volume materials. Its high precision and versatility set new standards in the processing of various precision materials and have attracted widespread attention from scientific research institutions and high-end manufacturing industries.

At present, as early as 2016, the global monocrystalline silicon wafer producers have basically switched all traditional mortar cutting (silicon carbide powder, steel wire, polyvinyl alcohol mixture) to diamond wire saw, which has greatly reduced the cost of monocrystalline silicon wafers, resulting in a certain cost-effectiveness advantage in the competition with multicrystalline silicon wafers. Therefore, multicrystalline silicon wafers must all switch to diamond wire slicing as soon as possible. Multicrystalline silicon wafer companies that do not switch will face the dilemma of being unable to survive.