Shenyang Kejing · 2026 High-End Grinding and Polishing Materials Conference

From April 14 to 16, 2026, the "High-End Grinding and Polishing Materials Conference & Forum on Ultra-Precision Processing of Semiconductor and Optical Materials" welcomed experts and key technical personnel from the materials processing sector across the globe.

Shenyang Kejing participated in the conference by showcasing its cutting and polishing equipment. On-site demonstrations of material processing operations and technical presentations were conducted, attracting significant interest from numerous clients. Notably, over a dozen companies engaged in in-depth discussions and exchanges with us, during which we shared insights into our corporate capabilities and developmental trajectory.

As semiconductor process nodes continue to shrink, the requirements for substrate surface flatness (Ra values), roughness control, and the remediation of surface damage layers have reached unprecedented levels of stringency. This forum served not merely as a platform for technical showcases, but also as an industry-wide consultation session focused on the critical question: "How can we achieve processing with even higher precision and greater repeatability?"

Precision Processing: The Interplay of "Equipment" and Quality.

1. Stress Control for High-Hardness, Brittle Materials.

For high-hardness, brittle semiconductor materials—such as silicon carbide (SiC) and sapphire—traditional cutting processes often result in micro-cracks or severe mechanical damage layers. Shenyang Kejing’s precision cutting equipment utilizes a unique tension compensation system combined with precise feed-rate control to achieve micrometer-level regulation of cutting stresses.

2. Grinding and Polishing Systems: From "Flatness" to "Atomic-Level Smoothness."

The core value of our grinding and polishing systems lies in the precise control exercised over the material removal mechanism, thereby completely eliminating the "edge effects" commonly encountered in traditional processing methods.

3. Integrated Quality Assurance System.

The essence of precision manufacturing lies not only in "how to cut" and "how to grind," but—crucially—in "how to measure."

Shenyang Kejing’s equipment integrates advanced, real-time process monitoring modules. Through multi-sensor fusion, the system provides real-time feedback on changes in torque, temperature, and pressure during the grinding process. This closed-loop data feedback system spanning the entire process ensures the high repeatability of experimental results. For researchers, this signifies that the process parameters derived in the laboratory can be seamlessly translated into Standard Operating Procedures (SOPs) for small-to-medium-scale production, thereby significantly accelerating the transition cycle from R&D to industrial commercialization.